Datapath components in performance-oriented superscalar processors drastically increase the complexity and energy dissipation of the processor. The energy dissipation is critical from the perspective of device reliability and cooling of the system. Up until now power consumption has not been of great concern since large packages, heat sinks and fans were capable of dissipating the generated heat. However, as the density of the chips continue to increase and systems are packaged into smaller and thinner enclosures it is becoming increasingly difficult to design adequate cooling system without incurring significant costs. Additionally, the reliability and operating lifetime of integrated circuits is greatly reduced when the ambient operating temperature increases because high temperature tends to exacerbate several silicon failure mechanisms such as electromigration, junction fatigue, and gate dielectric breakdown.